1. Cell Testing:
Sorting, visual inspection, and performance testing of silicon cells to ensure consistent efficiency.
2. Laser Scribing:
Using a laser to cut whole cells into half or smaller pieces to reduce solder ribbon current loss and improve power output.
3. Soldering & Stringing:
Soldering cells with different polarities into strings using solder ribbons; this is the core conductive step of the module.
4. Layup:
Laying EVA film, welded cell strings, another layer of EVA film, and a backsheet (or double-glass) onto tempered glass in sequence to form the module structure.
5. Lamination:
Placing the laminated module into a laminator, melting the EVA film under high temperature and vacuum conditions to bond the glass, cells, and backsheet together, completing the vacuum seal.
6. Trimming:
Removing excess EVA film and material after lamination to keep the module edges smooth.
7. Framed:
Apply silicone to the component frame and install the aluminum alloy frame to enhance the component's mechanical strength and sealing.
8. Junction Box Assembly:
Install the junction box for current output and seal it securely.
9. Curing:
Heat the component to stabilize its structure.
10. Final Testing and Packaging:
Perform cleaning, EL (electroluminescence) crack detection, and IV performance testing (power measurement). After passing these tests, package and store the component.